Bonding is where most microfluidic and flow-cell programmes fail. We select the method from the material pair and the chemistry your channels will carry — not from whatever is convenient — and we verify every lot.
A chip that works unassembled can be destroyed by the wrong bonding route: adhesive wicking into channels, warpage from thermal cycles, or residual solvent attacking the polymer. We qualify the method on your actual media, then hold it constant.
Typical values. Tighter limits are available after a drawing review — share the functional requirement rather than a blanket tolerance.
| Parameter | Standard | Precision / achievable | Notes |
|---|---|---|---|
| Channel-to-port alignment | ±50 µm | ±20 µm | Vision or pin-based fixturing |
| Bond voids at critical areas | visual acceptance | none detected | Defined per drawing on request |
| Leak test method | pressure decay | dye penetration | Burst testing for pressure-rated parts |
| Channel deformation after bonding | measured & reported | no measurable change | Interferometry before/after comparison |
| Thermal fusion materials | PMMA, COC, COP | — | Adhesive-free channel interface |
| Solvent bonding materials | PMMA, PC, PSU, ABS | — | Solvent chosen per chemistry compatibility |
Every RFQ is reviewed by a process engineer — expect a reply within one business day, with the route we would run and where cost can be removed.
