Network interface card with dual SFP ports and a heatsink on a green circuit board.
Open computer case showing internal components, including a motherboard, RAM slots, and a cooling system.
Dual-port network interface card with metal casing and heat sink, suitable for server connections.
PCIe network interface card with dual SFP+ ports and a heatsink on a green circuit board.
Green circuit board with electronic components and a metal bracket for computer installation.
Network interface card with dual ports, metallic heatsink, and PCB, placed on an anti-static bag.
Network interface card with dual SFP ports and a heatsink on a green circuit board.
Network interface card with dual SFP ports and a heatsink on a green circuit board.
Open computer case showing internal components, including a motherboard, RAM slots, and a cooling system.
Dual-port network interface card with metal casing and heat sink, suitable for server connections.
PCIe network interface card with dual SFP+ ports and a heatsink on a green circuit board.
Green circuit board with electronic components and a metal bracket for computer installation.
Network interface card with dual ports, metallic heatsink, and PCB, placed on an anti-static bag.
Intel ausgebaute E810-XXVDA2 Dual-Port 25G Sonderpreis-NIC
FOB
MOQ:
1
Versand:
Express
Produktdetails
FAQ
Wesentliche Details
MOQ:1
Lieferzeit:1周
Versand:Express
Paketbeschreibung:Das Gerät wird einzeln in einem antistatischen Beutel verpackt, mit äußerem Wellpappkarton-Schutz und innerer stoßdämpfender Polsterung, gegen Stöße, Feuchtigkeit und statische Aufladung geschützt.
Produkteinführung
Marke: Intel (gezogen) | Modell: E810-XXVDA2 | Zustand: 99% neu, wie neu | Spezifikationen: PCIe 4.0 x16, Dual-Port 25GbE, E810 Next-Gen | Zielmärkte: Europa/USA, Singapur | Zielkunden: Wie-neu 25G, DPDK-Beschleunigung, Cloud-nativ, nahezu neu gezogen

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