Essential details
MOQ:10
Shipping:Air freight, Land freight, Sea freight
Product Code:CRY-11
Product Introduction
Product name: Quartz (SiO2) Crystal
Quartz is the piezoelectric crystal behind most frequency control in electronics, and at the same time a low-birefringence optical material. Synthetic single crystal is grown hydrothermally in an autoclave and comes in left-handed and right-handed forms.
Key properties:
Stress birefringence is low and refractive index uniformity is high, with transmission from 0.15 to 4 µm. The crystal is hard, chemically stable and thermally stable, and its piezoelectric effect is the most used of its properties:
Stress birefringence is low and refractive index uniformity is high, with transmission from 0.15 to 4 µm. The crystal is hard, chemically stable and thermally stable, and its piezoelectric effect is the most used of its properties:
mechanical pressure produces charge, which is what lets a quartz plate hold frequency in an oscillator. Low thermal expansion and good mechanical and optical properties make it useful in precision optics, laser technology, optical communication and X-ray optics as well as in electronics. In the structure, silicon and oxygen form tetrahedral units linked by shared oxygen atoms, and that framework is where the combination of hardness, stability and piezoelectricity comes from.
Typical use:
oscillators, filters and timers; sonar equipment; piezoelectric heaters; lenses and prisms for optical work; SAW substrates.
Fabrication and options:
Wafers in Ø2" (50.8 mm), Ø3" (76.2 mm) and Ø4" (100 mm) with ±0.2 mm tolerance, Y, X or Z cut, ST cut or AT cut, orientation tolerance ±12′ to 30′, thickness 0.5 ± 0.05 mm, roughness below 1.0 nm or below 0.5 nm on request. Primary orientation flat 16 ± 1.5 mm on Ø2", 22 ± 1.5 mm on Ø3", 32 ± 3.0 mm on Ø4". Packed in a Class 100 clean bag inside a Class 1000 clean room.
Wafers in Ø2" (50.8 mm), Ø3" (76.2 mm) and Ø4" (100 mm) with ±0.2 mm tolerance, Y, X or Z cut, ST cut or AT cut, orientation tolerance ±12′ to 30′, thickness 0.5 ± 0.05 mm, roughness below 1.0 nm or below 0.5 nm on request. Primary orientation flat 16 ± 1.5 mm on Ø2", 22 ± 1.5 mm on Ø3", 32 ± 3.0 mm on Ø4". Packed in a Class 100 clean bag inside a Class 1000 clean room.
Ordering:
Minimum order 10 pcs. Tell us the cut (AT, ST, Y, X or Z) and the target frequency; the cut and the thickness are quoted together.
Minimum order 10 pcs. Tell us the cut (AT, ST, Y, X or Z) and the target frequency; the cut and the thickness are quoted together.
Product Parameter：
Material | Quartz, SiO2 single crystal (synthetic)
Growth method | Hydrothermal
Crystal structure | Hexagonal
Lattice constant | a = 4.914 Å, c = 5.405 Å
Melting point | 1610 °C (phase transition at 573.1 °C)
Density | 2.684 g/cm3
Mohs hardness | 7
Specific heat | 0.18 cal/g
Thermal conductivity | 0.0033 cal/(cm·°C)
Thermoelectric constant | 1200 µV/°C at 300 °C
Refractive index | 1.544
Thermal expansion | α11 = 13.71 × 10-6 /K, α33 = 7.48 × 10-6 /K
Q value | 1.8 × 10^6 min
Sound velocity (SAW) | 3160 m/s
Frequency constant | 1661 kHz·mm
Electromechanical coupling | k2 BAW 0.65%, SAW 0.14%
Orientation | Y, X or Z cut; ST cut; AT cut
Orientation tolerance | ±12′ / ±30′
Dimension | Ø2" (50.8 mm), Ø3" (76.2 mm), Ø4" (100 mm), ±0.2 mm
Primary orientation flat | 16 ± 1.5 mm (Ø2"), 22 ± 1.5 mm (Ø3"), 32 ± 3.0 mm (Ø4")
Thickness | 0.5 ± 0.05 mm
Roughness | below 1.0 nm, or below 0.5 nm on request
Packing | Class 100 clean bag, Class 1000 clean room
Minimum order | 10 pcs
Growth method | Hydrothermal
Crystal structure | Hexagonal
Lattice constant | a = 4.914 Å, c = 5.405 Å
Melting point | 1610 °C (phase transition at 573.1 °C)
Density | 2.684 g/cm3
Mohs hardness | 7
Specific heat | 0.18 cal/g
Thermal conductivity | 0.0033 cal/(cm·°C)
Thermoelectric constant | 1200 µV/°C at 300 °C
Refractive index | 1.544
Thermal expansion | α11 = 13.71 × 10-6 /K, α33 = 7.48 × 10-6 /K
Q value | 1.8 × 10^6 min
Sound velocity (SAW) | 3160 m/s
Frequency constant | 1661 kHz·mm
Electromechanical coupling | k2 BAW 0.65%, SAW 0.14%
Orientation | Y, X or Z cut; ST cut; AT cut
Orientation tolerance | ±12′ / ±30′
Dimension | Ø2" (50.8 mm), Ø3" (76.2 mm), Ø4" (100 mm), ±0.2 mm
Primary orientation flat | 16 ± 1.5 mm (Ø2"), 22 ± 1.5 mm (Ø3"), 32 ± 3.0 mm (Ø4")
Thickness | 0.5 ± 0.05 mm
Roughness | below 1.0 nm, or below 0.5 nm on request
Packing | Class 100 clean bag, Class 1000 clean room
Minimum order | 10 pcs
