1.High thermal conductivity Compared with conventional PEEK, the thermal conductivity coefficient is increased by up to twofold. 2.High mechanical strength With a tensile strength of up to 130 MPa, this material offers more than six times the mechanical performance of traditional PC-based mobile phone materials. It also provides significantly better drop resistance than glass-ceramic materials. 3.Metallic texture The material delivers a metallic feel and appearance, making it a promising new solution to replace metal mobile phone rear covers in the future.