Core Features

• High‑speed signal integrity: Supports up to 40 GHz with low distortion.
• Extreme durability: Vibration/shock resistant, wide temperature range, long service life.
• Compression‑based contact: No soldering; ideal for repeated mating cycles.

Key Applications

• Semiconductor test sockets (IC, BGA, LGA).
• Board‑to‑board (PCB) interconnects.
• Aerospace & defense: Satellites, missiles, radar arrays, avionics.
• High‑end computing & communications: Supercomputers, RF components (attenuators, amplifiers).

Standard Offerings

Diameters: 0.254mm(.010"), 0.381mm(.015"), 0.508mm(.02"), 0.635mm(.025"), 0.762mm(.03"), 0.9652mm(.038"), 1.143mm(.045"), 1.27mm(.05"), 1.575mm(.062"), 1.905mm(.075"), 2.032mm(.08"), 2.286mm(.09"), 3.175mm(0.125"), 3.81mm(0.15"), 4.318mm(.017"), 5.08mm(0.2"), 7.112mm(.28")
Lengths: 0.508mm(0.02") to 12.7mm(0.5"), diameter dependent
VolumeFillRate: 28%
Tolerances: Diameter+/-5%, Length+20%/-0%, Fill+/-2%
Materials: Gold-plated Beryllium Copper Au/BeCu
CustomizationProperties: Diameter, Length, Fill, Tolerances and Material.