Core Structure and Material Advantages

Made of high-purity copper (purity ≥ 99.9%), the porous copper bar is processed through advanced extrusion to form a uniform, three-dimensional porous structure. The porous structure features high porosity (30%-60%) and interconnected pores, which not only retain the inherent high thermal conductivity of copper (thermal conductivity ≥ 380 W/(m·K)) but also maximize the contact area between the copper bar and the cooling liquid.

Application Scenarios

This porous copper bar is mainly used in liquid cooling systems of high-speed optical modules, including but not limited to:

Data Center Optical Communication Equipment: Applied to optical modules in server cabinets, switches, and optical transceivers, solving the heat dissipation problem of high-power, high-speed optical modules in dense deployment scenarios.
5G/6G Base Station Equipment: Used in optical modules of base station transceivers, adapting to the high-temperature working environment of outdoor base stations and ensuring stable signal transmission.
High-Performance Computing (HPC): Applied to optical modules in supercomputers and high-performance servers, providing efficient thermal management support for high-speed data transmission and computing.
Industrial Optical Equipment: Used in optical modules for industrial control, aerospace, and other fields, where high reliability and efficient heat dissipation are required.