CuAl Alloy Powder
CuAl Alloy Powder
Pure copper has excellent electrical conductivity, thermal conductivity, and ductility. With its high electrical conductivity, thermal conductivity, and good ductility, pure copper is widely used in fields such as electrical and electronics, heat dissipation, and mechanical manufacturing, for producing wires and cables, heat dissipation devices, heat exchangers, and precision components. It is a core candidate material for additively manufacturing high thermal conductivity components, though its application was previously limited by issues such as high laser reflectivity and unstable molten pools. Current technological breakthroughs in green/blue light printing processes and material modification have significantly improved its forming density and thermal conductivity stability, promoting its application in high-end fields such as electronic heat dissipation and aerospace. This effectively solves the processing challenges of complex components that are difficult to achieve with traditional manufacturing, gradually breaking through industry bottlenecks.
Excellent Corrosion Resistance · Good Wear Resistance · Excellent High-Temperature Stability · Additive Manufacturing
Excellent Corrosion Resistance · Good Wear Resistance · Excellent High-Temperature Stability · Additive Manufacturing
Process Advantages
Process Advantages
High sphericity of 97.95%: Plasma rotating electrode atomization technology, excellent sphericity, very few satellite particles, uniform and dense powder spreading;
High sphericity of 97.95%: Plasma rotating electrode atomization technology, excellent sphericity, very few satellite particles, uniform and dense powder spreading;
Hollow rate of 0.036%: Plasma rotating electrode atomization technology results in an extremely low hollow rate, producing dense parts without voids;
Hollow rate of 0.036%: Plasma rotating electrode atomization technology results in an extremely low hollow rate, producing dense parts without voids;
Excellent physical properties: high electrical conductivity, thermal conductivity, and good ductility;
Excellent physical properties: high electrical conductivity, thermal conductivity, and good ductility;
Low oxygen and nitrogen content: oxygen content <70ppm, nitrogen content <2ppm, reducing the oxygen content of the formed part;
Low oxygen and nitrogen content: oxygen content <70ppm, nitrogen content <2ppm, reducing the oxygen content of the formed part;
Excellent powder performance: Cu alloy powder has a narrow particle size distribution (D10: 62.59μm, D50: 94.52μm, D90: 142.6μm);
Excellent powder performance: Cu alloy powder has a narrow particle size distribution (D10: 62.59μm, D50: 94.52μm, D90: 142.6μm);
Application Scenarios
Application Scenarios
SEM image of Cu powder prepared by PRPE
SEM image of Cu powder prepared by PRPE
Powder Morphology
Powder Morphology
Electronic heat dissipation components Rocket engine Induction coil
Electronic heat dissipation components Rocket engine Induction coil
Pure copper powder, with its ultimate thermal conductivity and advantages in precision additive manufacturing, is becoming a core material in high-value-added manufacturing fields. From electronic device heat dissipation components to aerospace parts, it has achieved integrated forming of complex structures and performance upgrades in practical applications. With the large-scale application of green/blue light printing technology and the optimization of low-oxygen powder preparation processes, pure copper powder will further deepen its presence in the high-value-added tracks of heat dissipation and consumer electronics, helping products achieve breakthroughs in lightweight design, high efficiency, and low cost.
Pure copper powder, with its ultimate thermal conductivity and advantages in precision additive manufacturing, is becoming a core material in high-value-added manufacturing fields. From electronic device heat dissipation components to aerospace parts, it has achieved integrated forming of complex structures and performance upgrades in practical applications. With the large-scale application of green/blue light printing technology and the optimization of low-oxygen powder preparation processes, pure copper powder will further deepen its presence in the high-value-added tracks of heat dissipation and consumer electronics, helping products achieve breakthroughs in lightweight design, high efficiency, and low cost.
Chemical Composition
Chemical Composition
Powder cross-section
Powder cross-section
Cross-sectional OM image of Cu powder prepared by PRPE
Cross-sectional OM image of Cu powder prepared by PRPE
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